Single-Phase Immersion Tank

Immersion is the end of the density argument. Submerge the board and there is no air path left to optimise, no fan to fail, and no thermal interface material to argue about.

Every watt to fluid

Direct-to-chip captures 75 to 95 % of rack heat and leaves the rest — memory, drives, VRMs, network — for the air system to collect. The T200 captures all of it. That last fifteen percent is exactly the part that forces you to keep a CRAH plant running, which is why the partial PUE lands at 1.04 rather than 1.08.

The fans that stop existing

Server fans consume 8 to 15 % of IT power in a dense air-cooled rack. In the T200 there are none, so that power is not spent and its heat is not generated. It is the rare efficiency measure that improves two terms of the equation at once.

What changes operationally

We are direct about this: immersion changes how your team works. Boards come out wet and drip into a tray on a gantry. Some components need qualification for fluid compatibility. Sites that succeed with immersion decide to change procedure deliberately; sites that treat it as a drop-in are the ones that struggle.

Warm water, no chiller

At 45 °C facility water the T200 still holds junction temperatures comfortably. At that supply a dry cooler covers the year in almost any climate and the chiller becomes a redundancy asset rather than an operating cost.