A wide, low-profile plate for rectangular CPU packages where the constraint is usually socket load rather than thermal budget. Channel geometry is biased toward the hotter compute tiles rather than distributed evenly, because a uniform plate on a non-uniform die wastes half its capability.
The retention system spreads load through the socket’s own frame and is designed for repeated service without re-lapping. At 1.2 L/min and 25 °C inlet the plate measures 0.028 °C/W with a pressure drop of 24 kPa.
