Seventeen parallel copper microchannels, 0.5 mm wall, 1.5 mm pitch, machined from a single billet and electron-beam welded. Designed for a 25 °C inlet at 1.5 L/min, where it measures 0.021 °C/W from die surface to fluid and 33 kPa across the plate.
The cold face is lapped flat to 10 µm and shipped with the interface material we characterised it with. Mounting hardware provides even pressure across the full package area, because on a reticle-limit die a hot corner is a pressure problem far more often than it is a flow problem.
Supplied with a thermal datasheet including the full pressure-drop and thermal-resistance curves, a STEP model, and the fluid specification for the loop it will live in.
