Direct-to-Chip
KX-PLATE GX1600
GPU Cold Plate, 1,600 W Class
A skived copper microchannel plate rated to 1,600 W per package at a thermal resistance of 0.015 K/W.
- Rated capacity
- 1.6 kW
- Per rack
- 160 kW
- Nominal Delta-T
- 8 K
- Nominal flow
- 2.9 L/min
- Supply water
- W32 – W45 (32 – 45 °C)
- Max pressure
- 4.0 bar
- Partial PUE
- 1.08
- Working fluid
- PG25 or treated water
An accelerator that dissipates 1,600 W has roughly eight square centimetres to do it through. That is a heat flux no air-cooled heatsink will ever service, and it is why the cold plate has become the most consequential mechanical part in the rack.
Skived, not brazed
The GX1600 fin stack is skived from a solid copper billet, so the fins and the base are one continuous piece of metal with no braze joint and no interface resistance between them. At a 0.3 mm channel pitch the wetted area is large enough to hold package-to-fluid resistance at 0.015 K/W.
Even pressure, thousands of cycles
Die contact is only as good as the last thermal cycle left it. A spring-loaded backplate keeps the load even across the package as the assembly heats and cools, which matters more over three years than the first-day paste measurement everyone quotes.
Chemistry
The wetted path is nickel plated. In a loop that inevitably contains stainless fittings, aluminium chassis parts and copper tube, that plating is what keeps galvanic corrosion from turning into a particulate problem somewhere downstream.
Warm water is the point
The GX1600 is qualified from 32 °C supply. Running warm is not a compromise you accept — it is the whole economic argument, because it is what lets the facility loop reject heat without a chiller for most of the year.
Technical data
Full specification
Values are at nominal duty. Ask us for the full performance map if you are working outside these conditions.
| Rated device power | 1,600 W |
|---|---|
| Thermal resistance | 0.015 K/W |
| Nominal flow rate | 2.9 L/min |
| Nominal Delta-T | 8 K |
| Supply water temperature | 32 – 45 °C |
| Pressure drop at nominal flow | 0.32 bar |
| Maximum working pressure | 4 bar |
| Channel pitch | 0.3 mm |
| Base material | C110 copper, nickel plated |
| Fitting type | G1/4 or blind-mate UQD |
| Dimensions (L × W × H) | 96 × 96 × 22 mm |
| Mass | 640 g |
| Heat capture ratio | 85 – 95 % |
Module 05 — Flow envelope
Delta-T against required flow
This unit rejects 2 kW. Widening the temperature difference across the loop cuts the volume of water you have to move — and pump power falls with roughly the cube of flow.
- Required flow
- 2.87 L/min
- Return temperature
- 38.0 °C at W30 supply
- Relative pump power
- 100 % of nominal
Water at 4.18 kJ/kg·K, density taken as 1 kg/L. Pump power index scales with the cube of the flow ratio against this unit’s nominal 8.0 K design point.
Related
Others in this range
KX-PLATE CX500
CPU Cold Plate, 500 W Class
A low-profile CPU plate for dense 1U nodes, rated to 500 W with a 0.021 K/W resistance.
- Capacity
- 0.5 kW
- Per rack
- 120 kW
- Delta-T
- 8 K