Skip to content

Direct-to-Chip

KX-PLATE GX1600

GPU Cold Plate, 1,600 W Class

A skived copper microchannel plate rated to 1,600 W per package at a thermal resistance of 0.015 K/W.

Rated capacity
1.6 kW
Per rack
160 kW
Nominal Delta-T
8 K
Nominal flow
2.9 L/min
Supply water
W32 – W45 (32 – 45 °C)
Max pressure
4.0 bar
Partial PUE
1.08
Working fluid
PG25 or treated water
Full specifications
Precision-machined copper microchannel cold plate for a GPU accelerator with stainless steel fittings

An accelerator that dissipates 1,600 W has roughly eight square centimetres to do it through. That is a heat flux no air-cooled heatsink will ever service, and it is why the cold plate has become the most consequential mechanical part in the rack.

Skived, not brazed

The GX1600 fin stack is skived from a solid copper billet, so the fins and the base are one continuous piece of metal with no braze joint and no interface resistance between them. At a 0.3 mm channel pitch the wetted area is large enough to hold package-to-fluid resistance at 0.015 K/W.

Even pressure, thousands of cycles

Die contact is only as good as the last thermal cycle left it. A spring-loaded backplate keeps the load even across the package as the assembly heats and cools, which matters more over three years than the first-day paste measurement everyone quotes.

Chemistry

The wetted path is nickel plated. In a loop that inevitably contains stainless fittings, aluminium chassis parts and copper tube, that plating is what keeps galvanic corrosion from turning into a particulate problem somewhere downstream.

Warm water is the point

The GX1600 is qualified from 32 °C supply. Running warm is not a compromise you accept — it is the whole economic argument, because it is what lets the facility loop reject heat without a chiller for most of the year.

Technical data

Full specification

Values are at nominal duty. Ask us for the full performance map if you are working outside these conditions.

Technical specifications
Rated device power 1,600 W
Thermal resistance 0.015 K/W
Nominal flow rate 2.9 L/min
Nominal Delta-T 8 K
Supply water temperature 32 – 45 °C
Pressure drop at nominal flow 0.32 bar
Maximum working pressure 4 bar
Channel pitch 0.3 mm
Base material C110 copper, nickel plated
Fitting type G1/4 or blind-mate UQD
Dimensions (L × W × H) 96 × 96 × 22 mm
Mass 640 g
Heat capture ratio 85 – 95 %

Module 05 — Flow envelope

Delta-T against required flow

This unit rejects 2 kW. Widening the temperature difference across the loop cuts the volume of water you have to move — and pump power falls with roughly the cube of flow.

0.0 1.5 3.0 4.5 6.0 4 K 8 K 12 K 16 K 20 K Flow — L/min Loop Delta-T
Required flow
2.87 L/min
Return temperature
38.0 °C at W30 supply
Relative pump power
100 % of nominal

Water at 4.18 kJ/kg·K, density taken as 1 kg/L. Pump power index scales with the cube of the flow ratio against this unit’s nominal 8.0 K design point.

Related

Others in this range